High-Precision Micron-Level Hole Laser Processing System:

  • High Speed: Capable of processing up to 4000 holes per second.
  • High Precision: Achieves less than 3μm precision in processing.
  • No Material Restrictions: Effective on metals, ceramics, silicon wafers, organics, and more.
  • Programmable Hole Shapes: Can create holes as small as 5μm with specific tapered shapes.
  • Customizable Distribution: Offers a processing area of 300mm*300mm without the need for molds or masks.
  • Environmentally Friendly: Pollution-free process without the use of consumables.
  • Direct Processing: Enables direct forming and processing without additional steps.

Features

  • High-Power Ultraviolet Laser: Direct material ablation and vaporization, with micrometer-level processing apertures and thermal impact zones.
  • Precision Galvanometer Scanning: High-speed, high-accuracy beam deflection for small-area precision micro-hole processing.
  • High-Speed Linear Motor Platform: Allows for large-area, high-accuracy micro-hole processing at a micrometer level.
  • Adjustable Z-Axis: Adaptable to various material thicknesses for specific tapered hole processing.
  • Off-Axis Super-Resolution Industrial Camera: Ensures full-field error correction, ultra-high precision focusing, and online measurement for long-term stability and accuracy.
  • Marble Worktable: Enhances system stability with carefully selected mechanical components for sustained precision.
  • Processing Capabilities: Minimum micro-hole diameter of 5μm; overall accuracy of ±4μm; local feature accuracy of <3μm; processing area of 300*300mm.
  • Material Versatility: Suitable for various materials including metals, ceramics, silicon wafers, glass, and organics. Ideal for micro-hole processing and precision cutting.

Techical Parameter

Category Parameter FM-UVM3A FM-UVM3B
Laser Wavelength 355nm 355nm
Power >3W@40kHz (3~40W optional) >3W@40kHz (3~40W optional)
Modulation Frequency 1~200kHz 1~200kHz
Pulse Width 15ns@40kHz 15ns@40kHz
Beam Quality M2 <1.2 <1.2
Galvanometer Scanning Range <50*50mm <15*15mm
Repeat Accuracy <1μm <1μm
Positioning Accuracy ≤±3μm ≤±3μm
XY Worktable Travel 300*300mm (600*600mm optional) 300*300mm (600*600mm optional)
Positioning Resolution 0.1μm 0.1μm
Repeat Accuracy ≤±1μm ≤±1μm
Positioning Accuracy ≤±3μm ≤±3μm
Acceleration ≤1G ≤1G
Speed ≤200mm/s ≤200mm/s
Z Axis Travel 150mm 150mm
Repeat Accuracy ≤±3μm ≤±3μm
CCD Monitoring and Positioning Camera 5 Megapixels 5 Megapixels
Optical Magnification 10X 10X
Area Stitching Accuracy ±3μm ±3μm
Processing Capability Minimum Spot Size 8μm 5μm
System Processing Accuracy ±5μm ±5μm
Repeat Accuracy ≤±1μm ≤±1μm
Processing Materials Glass, organics, metals, ceramics, etc. Glass, organics, metals, ceramics, etc.
Cooling Water cooling (1500W cooling capacity) Water cooling (1500W cooling capacity)
Other Dust Extraction Triple dust purification Triple dust purification
Electricity 220V 50~60Hz 220V 50~60Hz
Power Consumption ≤2000W ≤2000W
Dimensions Size 1200*1200*1900mm 1200*1200*1900mm
Weight 1200Kg 1200Kg
Note Constant temperature (25±0.5℃) achieved after 30 minutes of preheating. Parameters may vary with material processing and equipment upgrades.

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Sky Fire Precision employs cutting-edge technology to offer custom laser precision parts online. With our robust capabilities and extensive supply chain, we consistently offer competitive pricing. Our capacity allows us to handle both intricate prototypes and large-scale production runs, catering to a wide variety materials such as metals, non-metals, plastics, polymers, and transparent materials.

  • Experience: Since 2017                     Volume: 1-200K+ Parts       
  •  Quoting: Within 24 Hours                 Part Size: Ranging Custom   
  •  Delivery: In As Fast As 7 Day          Tolerances: 1~500μm line width
  •  Materials: Metals, Nonetals, Polymers, Transparent and Special Materials
  •  Using Over 70 Materials               
  • Price: Start From 250USD
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