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- Overview:
- Techniques: Micro-hole machining, micro-groove machining, precision cutting, precision etching, precision marking.
- Materials and processes tailored for customer applications such as filtration, light transmission, ventilation, throttling, masking, precision circuits, and more.
- Specifications:
- Material Thickness: 10μm~5mm
- Processing Line Width: Minimum 5μm
- Types of Materials:
- Ceramics (e.g., Al2O3, AlN, SiC)
- Silicon wafers
- Coated products
Gold-Plated Ceramic Circuit Etching
- Specifications:
- 3D structure, processing accuracy of ±5μm.
- Etching of gold-plated ceramic circuits.
Flexible Circuit Etching
Minimum linewidth of 6μm
- Specifications:
- Minimum line width of 20μm.
- Precision laser etching for flexible circuits.
Silicon Wafer Hole Punching
- Specifications:
- Holes of 50μm.
- Laser hole punching in silicon wafers.
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Sky Fire Precision employs cutting-edge technology to offer custom laser precision parts online. With our robust capabilities and extensive supply chain, we consistently offer competitive pricing. Our capacity allows us to handle both intricate prototypes and large-scale production runs, catering to a wide variety materials such as metals, non-metals, plastics, polymers, and transparent materials.
- Experience: Since 2017 Volume: 1-200K+ Parts
- Quoting: Within 24 Hours Part Size: Ranging Custom
- Delivery: In As Fast As 7 Day Tolerances: 1~500μm line width
- Materials: Metals, Nonetals, Polymers, Transparent and Special Materials
- Using Over 70 Materials
- Price: Start From 250USD
- +86-13125144905
- [email protected]
- No. 17 Jinxiu Avenue, Wulijie Street, Jiangxia District, Wuhan, Hubei, China, 430050