Aerospace Communication Micro-hole Processing

Material Specifications:

Laser precision micro-hole processing has several advantages over methods such as EDM micro-hole drilling, mechanical drilling, chemical etching, mechanical punching, and others:

Key Advantages:

• High speed (up to 4000 holes per second).
• High accuracy (less than 3μm).
• No material limitations (metals, ceramics, silicon wafers, organic materials, etc.).
• Programmable hole shapes (minimum entrance 5μm, exit 1~2μm, with specific conical holes).
• Customizable distribution (processing range of 300mm x 300mm) without the need for molds and masks.
• Pollution-free and consumable-free.
• Direct processing.

Equipment Specifications:

Sky Fire Precision’s laser micro-hole drilling equipment provides:

• A minimum micro-hole diameter (linewidth) of 5μm.
• Overall processing accuracy of ±4μm.
• Local feature accuracy of less than 3μm.
• Processing range of 300mm x 300mm.
• Suitable for precision blind holes, through-holes, slotting, cutting, etc. on metals, ceramics, silicon wafers, glass, and organic materials.

Primary Applications:

• Semiconductor flexible circuit board cutting.
• ITO film layer etching.
• Microelectronic device manufacturing.
• Printing template preparation.
• Biochip production.
• Precision mold forming.
• Precision instruments and meters