Copper Micro-hole Machining

Micro-hole Machining for Superconductivity Application

Copper Micro-hole Machining:

• Material: Oxygen-free Copper
• Thickness: 50μm
• Hole Diameter: 400μm

Utilizing micro-hole machining technology developed by Sky Fire Precision Laser, we ensure hole roundness, precision, burr-free edges, and minimal thermal effects. Using laser technology, this method surpasses traditional mechanical drilling and punching in various ways, such as:

• Controlled Hole Shape: The shape of the hole can be controlled down to a minimum of 5μm.
• High Speed: Up to 4000 holes per second on plastic films with a thickness of 50μm or less.
• High Precision: Accuracy of less than 3μm.
• Versatile Material Compatibility: Suitable for materials such as organic glass, acrylic, and more.
• Customizable Distribution: A processing area of 300mm x 300mm, which is expandable.
• Clean and Economical: No tool wear, no noise, and no consumables.
• Direct Processing: The final product often requires no further processing or only minimal post-processing.

Sky Fire Precision Solutions:

Sky Fire Precision offers clients laser solutions for precision micro-holes, precision etching, precision cutting, and precision molding with feature linewidths ranging from 1μm to 500μm. With a processing area exceeding 300mm x 300mm, the overall processing accuracy is up to ±2μm, and the local feature precision is less than 2μm. Materials such as metals, ceramics, sapphire, organics (plastics), glass, and more can be processed.