Metal Foil

Metal Foil Varieties:

Processing of micro-holes in various metal foils such as titanium foil, stainless steel foil, copper foil, etc. can achieve a minimum size of 1μm.

When compared to EDM micro-hole processing, mechanical drilling, chemical etching, mechanical punching, and other techniques, laser precision micro-hole processing offers the following advantages:

• High Speed: Capable of processing up to 4000 holes per second.
• High Precision: Accuracy of less than 3μm.
• Versatile Material Compatibility: Suitable for metals, ceramics, silicon wafers, organics, and more.
• Programmable Hole Shapes: Minimum entrance size of 5μm and exit size between 1μm and 2μm, including specific taper holes.
• Customizable Distribution: A processing area of 300mm x 300mm without the need for molds and masks.
• Clean and Economical: No pollution and no consumables.
• Direct Processing: Often no need for further processing or only minimal post-processing.

Sky Fire Precision Solutions:

Sky Fire Precision’s laser micro-hole punching equipment can process micro-holes with a diameter (linewidth) as small as 5μm, with an overall processing accuracy of ±4μm, and a local feature precision of less than 3μm. With a processing area of 300mm x 300mm, this equipment can be used for precision blind holes, through holes, grooves, and cutting in materials such as metals, ceramics, silicon wafers, glass, organics, etc.

Main applications include semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing, printing template preparation, biochip production, precision mold forming, and precision instruments and meters.