Forked Electrode Metal Mask Plates

Precision Cutting of Metal Mask Plates

Precision Cutting of Forked Electrode Metal Mask Plates

• Laser precision cutting offers several advantages over traditional etching processes:
  • High accuracy (less than ±2μm)
  • No material limitations (metals, ceramics, silicon wafers, organics, etc.)
  • Programmable (minimum feature size of 3μm, with a maximum processing area expandable to 300x300mm)
  • Pollution-free and no consumables
  • Direct etching and molding without a photomask process

Sky Fire Precision’s Laser Equipment

• Provides laser precision machining equipment with a minimum processing linewidth of 3μm
• Overall processing accuracy is up to ±2μm
• Local feature precision is less than 2μm
• A processing area of 300x300mm
• Suitable for precision blind holes, through holes, slotting, and cutting processing of materials like metals, ceramics, silicon wafers, glass, organics, and more.