Puncture Needles

Laser precision etching of puncture needles, precision etching of positioning holes, high surface finish, and high accuracy

Laser Precision Etching of Puncture Needles at Sky Fire Precision

Technical Precision

• Machining Accuracy: Minimum processing linewidth of 5μm, overall accuracy of ±4μm, and local feature precision less than 2μm.
• Machining Area: Optimized for a 300x300mm workspace.

Material Flexibility

• Suitable for substrates including glass, sapphire, metal, ceramic, and organic materials.

Advanced Laser System

• UV Laser: High-power and ultra-stable system that directly ablates and vaporizes materials.
• Micrometric Precision: Achieving μm-level machining linewidths and minimal thermal impact.

High-Speed Control and Operation

• Imported Galvanometers: Control beam deflection with high precision at speeds up to 15m/s.
• Linear Motor Platform: Micron-level high-speed platform for expansive etching.

System Adaptability

• Adjustable Z-axis: Catering to materials of varying thicknesses and intricate 3D etching.
• Super-resolution Cameras: Side-axis cameras for error correction, precise focusing, and real-time linewidth measurement.

Optimized Processing and Durability

• Online Laser Monitoring: Rapid optimization via real-time laser processing detection.
• Robust Infrastructure: Marble table base for enhanced stability and meticulously selected mechanical components.

Applications

• Ideal for precision etching of circuits or graphics on various substrates.